Heat dissipation device with heat pipe within base

ABSTRACT

A heat dissipation device includes a base, at least one heat pipe, and a fin assembly. The base is substantially planar. The base includes a first interface and a second interface opposite to the first interface. The first interface is adapted to contact a heat element. The base defines a slot at the second interface. The at least one heat pipe is received in the slot. The fin assembly contacts the second interface and the at least one heat pipe simultaneously.

BACKGROUND

1. Technical Field

The present disclosure relates to a heat dissipation device.

2. Description of Related Art

In an electronic device, a heat sink may be used to dissipate heat from a heat generating element. The heat sink may include a base, a number of fins, and a heat pipe. The heat pipe may be connected to the base at one end and to the number of fins at the other end. A fan may be mounted on a top or a side of the number of fins to dissipate heat from the heat sink. However, heat from the base may only be dissipated from the number of fins through the heat pipe since a heat contact surface is limited. There is room for improvement within the art.

BRIEF DESCRIPTION OF THE DRAWINGS

Many aspects of the embodiments can be better understood with references to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.

FIG. 1 is an exploded, isometric view of a heat dissipation device in one embodiment.

FIG. 2 is a partially assembled view of FIG. 1.

FIG. 3 is an assembled view of FIG. 1.

DETAILED DESCRIPTION

The disclosure is illustrated by way of example and not by way of limitation in the figures of the accompanying drawings in which like references indicate similar elements. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean at least one.

Referring to FIG. 1, in one embodiment, a heat dissipation device includes a base 30, a plurality of heat pipes 50, and a fin assembly 10. The heat dissipation device can dissipate heat from a heat element 110 on a motherboard 100. The heat element 110 may be a processor.

The base 30 is substantially planar. The base 30 may be rectangular. The base 30 includes a first interface 31 for contacting the heat element 110 and a second interface 33 on opposite sides of the first interface 31. The base 30 includes a thermal contact area 332 for contacting the heat element 110. The thermal contact area 332 may be located at a middle portion of the base 30. The base 30 defines two through openings 35 at opposite sides of the thermal contact area 332. Each of the two through openings 35 may be rectangular-shaped. The base 30 defines a slot 37 at the second interface 33 for receiving the plurality of heat pipes 50. A depth of the slot 37 is less than a thickness of the base 30.

In one embodiment, the plurality of heat pipes 50 includes a first heat pipe 51 and two second heat pipes 53. The first heat pipe 51 is configured to a substantially Z shape. Each of the two second heat pipes 53 is configured to a substantially L shape. The first heat pipe 51 includes a first main portion 511 and two first extension portions 513 connected to opposite sides of the first main portion 511. The first main portion 511 is located at the thermal contact area 332. The two first extension portions 513 extend out from the thermal contact area 332. Each of the two second heat pipes 53 includes a second main portion 531 and a second extension portion 533. The second main portion 531 is located at the thermal contact area 332. The second extension portion 533 extends around each of the two through openings 35. The two second heat pipes 53 may have substantially the same configuration. The two second heat pipes 53 may be symmetrical about a central point of the base 30.

The fin assembly 10 may include a plurality of parallel fins.

Referring to FIG. 2, in assembly, the plurality of heat pipes 50 are positioned into the slot 37 of the base 30. The plurality of heat pipes 50 are located substantially within the base 30. The plurality of heat pipes 50 extend within an extension plane, which is substantially parallel to a plane of the second interface 33. A top surface of each of the plurality of heat pipes 50 is substantially flushed with the second interface 33. The fin assembly 10 is fixed to the base 30. The fin assembly 10 contacts the second interface 33 of the base 30 and the plurality of heat pipes 50 simultaneously.

Referring to FIG. 3, in use, the assembled heat dissipation device may be located on the motherboard 100 to dissipate heat from the heat element 110. The thermal area 332 contacts the heat element 110. Heat generated from the heat element 110 may be transmitted to the base 30. The base 30 may transmit the heat through the plurality of heat pipes 50 or directly transmit the heat to fin assembly 10.

In other embodiment, one or more heat pipe may be used. A cross-sectional view of each heat pipe may be rectangular, round or ellipse. The shape of the slot 37 may alternate according to different kinds of heat pipe.

In other embodiment, the base 30 and the plurality of heat pipes 50 may use different materials due to consideration for cost or weight. A weight-to-volume density of the plurality of heat pipes 50 may be larger than a weight-to-volume density of the base 30. For example, the plurality of heat pipes 50 may include copper, and the base 30 may include aluminum.

It is also to be understood, however, that even though numerous characteristics and advantages have been set forth in the foregoing description of preferred embodiments, together with details of the structures and functions of the preferred embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed. 

1. A heat dissipation device comprising: a base, the base being substantially planar, the base comprising a first interface and a second interface opposite to the first interface, the first interface being configured to contact a heat element, and the base defining a slot at the second interface; at least one heat pipe received in the slot; and a fin assembly contacting the second interface and the at least one heat pipe simultaneously.
 2. The heat dissipation device of claim 1, wherein an interface between the at least one heat pipe and the fin assembly is substantially flushed with the second interface.
 3. The heat dissipation device of claim 1, wherein a depth of the slot is less than a thickness of the base.
 4. The heat dissipation device of claim 1, wherein the at least one heat pipe is located substantially within the base.
 5. The heat dissipation device of claim 1, wherein the at least one heat pipe extends within an extension plane substantially parallel to a plane of the second interface.
 6. The heat dissipation device of claim 1, wherein the base comprises a thermal contact area and two through openings at opposite sides of the thermal contact area, the thermal contact area is configured to contact the heat element.
 7. The heat dissipation device of claim 6, wherein the at least one heat pipe comprises a first heat pipe and two second heat pipes, the first heat pipe is substantially Z shaped, and each of the two heat pipes is substantially L shaped.
 8. The heat dissipation device of claim 7, wherein the first heat pipe comprises a first main portion and two first extension portions, each of the two first extension portions is connected to each opposite side of the first main portion, the first main portion is located at the thermal contact area, and each of the two first extension portions extends out from the thermal contact area.
 9. The heat dissipation device of claim 7, wherein each of the two second pipes comprises a second main portion and a second extension portion, the second main portion is located at the thermal contact area, and the second extension portion extends around each of the two through openings.
 10. The heat dissipation device of claim 7, wherein the two second heat pipes are symmetrical about a central point of the base.
 11. The heat dissipation device of claim 1, wherein a weight-to-volume density of the at least one heat pipe is larger than a weight-to-volume density of the base.
 12. The heat dissipation device of claim 11, wherein the at least one heat pipe comprises copper, and the base comprises aluminum.
 13. A heat dissipation device comprising: a base, the base being substantially planar, the base comprising a first interface and a second interface opposite to the first interface, the first interface being configured to contact a heat element, and the base defining a slot at the second interface; at least one heat pipe received in the slot and located substantially within the base; and a fin assembly contacting the second interface.
 14. The heat dissipation device of claim 13, wherein an interface between the at least one heat pipe and the fin assembly is substantially flushed with the second interface.
 15. The heat dissipation device of claim 13, wherein a depth of the slot is less than a thickness of the base.
 16. The heat dissipation device of claim 13, wherein the fin assembly contacting the second interface and the at least one heat pipe simultaneously.
 17. The heat dissipation device of claim 13, wherein the base comprises a thermal contact area and two through openings at opposite sides of the thermal contact area, the thermal contact area is configured to contact the heat element.
 18. The heat dissipation device of claim 17, wherein the at least one heat pipe comprises a first heat pipe and two second heat pipes, the first heat pipe is substantially Z shaped, and each of the two heat pipes is substantially L shaped.
 19. The heat dissipation device of claim 17, wherein the first heat pipe comprises a first main portion and two first extension portions, each of the tow first extension portions is connected to each opposite side of the first main portion, the first main portion is located at the thermal contact area, and each of the two first extension portions extends out from the thermal contact area.
 20. The heat dissipation device of claim 17, wherein each of the two second pipes comprises a second main portion and a second extension portion, the second main portion is located at the thermal contact area, and the second extension portion extends around each of the through openings. 